Infrastructure

Our lab features a range of equipment, processes and facilities designated for the pattern generation and replication as well as operation and characterization of primarily polymeric microfluidic "lab-on-a-chip" systems. Our capabilities encompass tool making by (3D) ultraprecision milling (UPM), mask-based and direct-writing lithography, (silicon) etching, surface micromachining, elastomer casting, hot embossing, injection moulding and laser writing as well as 3D, screen and phase-change wax printing. Our backend processes include surface functionalization, assembly and bonding with equipment such as plasma chambers and pens, (hot) roll lamination and alignment. Our competences comprise the manufacture 3D-architectures and multi-material hybrids for highly integrated microfluidic systems.